• 无卤PI覆铜箔基材 Halogen-Free Polyimide Film Based FCCL

    产品特点:
    优异的耐高温高湿性能
    良好的尺寸安定性、挠曲性及耐离子迁移
    优良的电性能,化学性能及耐热性能
    不含卤素, 阻燃性能达到UL94 VTM-0
    本产品符合IPC规范

    Feature:
    Excellent high humidity and temperature resistance
    Excellent dimensional stability,High flexibility and
    Excellent Migration ability
    Excellent electrical ,chemical and thermal property
    Halogen free and Flame retardancy UL 94VTM-0
    Meet with IPC standards

    产品特性(FCCL Characteristic):
    特性
    property
    单位
    Unit
    条件
    Condition
    标准
    Standard
    AFED131218 AFED131212 测试方法
    Test method
    Copper Foil
    Adhesive
    PI Film
    Adhesive
    Copper Foil
    Peel Strength Kgf/cm
    (90?)
    normal H mil≧0.8
    1 mil≧1.0
    1.3~1.5 1.1~1.3 IPC-TM-650 2.4.9
    Dimension Stability TD % Method B ≦±0.15 0.05~0.10 0.40~0.08 IPC-TM-650 2.2.4
    MD % -0.05~0.06 -0.07~0.03
    Solder Float Resistance --- 300℃/10sec No Change Appearance Pass Pass IPC-TM-650 2.4.13
    Chemical Resistance % NaOH ≦20 1~7 1~7 IPC-TM-650 2.3.2
    % HCI 1~8 1~8
    % IPA 1~7 1~7
    Moisture Absorption % D-24/23 ≦2.0 0.9~1.3 1.0~1.4 IPC-TM-650 2.6.2
    Volume Resistance Ω-cm C-96/23/65 ≧1012 ≧1014 ≧1014 IPC-TM-650 2.5.17
    Surface Resistance Ω C-96/23/65 ≧1010 ≧1012 ≧1012
    Insulation resistance Ω C-96/23/65 ≧109 ≧109 ≧109 IPC-TM-650 2.6.3.2
    Dielectric constant 10MHZ --- C-48/40/90 ≦4.0 3.4~3.6 IPC-TM-650 2.5.5.3
    Dissipation factor 10MHZ --- C-48/40/90 ≦0.04 0.032~0.036
    Note:1. Data shown above are nominal values for reference only,Details see Certification of Quality
      2. Storage Condition:Vacuum Packaging: Below 30℃ for 1year,
    Normal Packaging : Below 30℃,below 70% RH for 1year
    十分快3